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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/21 tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 datasheet automotive 1.5a variable output ldo regulator bdxxhc5mefj-m general description bdxxhc5mefj-m is a ldo regulator with output current 1.5a. t he output accuracy is 1% of output voltage. with external resistance, it is available to set the output voltage at random (from 1.5v to 7.0v).it has package type: htsop-j8. over current protection (for protecti ng the ic destruction by output short circuit), circuit current on/off switch (for setting the circuit 0 a at shutdown mode), and thermal shutdown circuit (for protecting ic from heat destruction by over load condition) are all built in. it is usable for ceramic capacitor and enables to improve smaller set and long-life. features ? high accuracy reference voltage circuit ? built-in over current protection circuit (ocp) ? built-in thermal shut down circuit (tsd) ? with shut down switch ? aec-q100 qualified key specifications ? input power supply voltage range: 4.5v to 8.0v ? output voltage range(variable type): 1.5v to 7.0v ? output voltage(fixed type): 1.5v/1.8v/2.5v/3.0v/3.3v 5.0v/6.0v/7.0v ? output current: 1.5a (max.) ? shutdown current: 0 a(typ.) ? operating temperature range: -40 to +105 typical application circuit package (typ.) (typ.) (max.) htsop-j8 4.90mm x 6.00mm x 1.00mm htsop-j8 r 1 v o v cc en gnd fin r 2 fb c out c in c in ,c out : ceramic capacitor v o v cc en gnd fin v o_s c out c in c in ,c out : ceramic capacitor
2/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 ordering information b d x x h c 5 m e f j - m e 2 part number output voltage 00:variable 15:1.5v 18:1.8v 25:2.5v 30:3.0v 33:3.3v 50:5.0v 60:6.0v 70:7.0v voltage resistance h:10v output current c5:1.5a automotive ?m?:m series package efj:htsop-j8 packaging and forming specification e2:emboss tape reel
3/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 block diagram bd00hc5mefj-m bdxxhc5mefj-m (fixed type) pin configuration pin description pin no. pin name pin function 1 v o output pin 2 fb/vo_s feedback pin 3 gnd gnd pin 4 n.c. non connection (used to connect gnd or open state.) 5 en enable pin 6 n.c. non connection (used to connect gnd or open state.) 7 n.c. non connection (used to connect gnd or open state.) 8 v cc input pin reverse fin substrate(connect to gnd) fig.1 block diagram fig.2 block diagram (fixed type) fin gnd en ceramic capacitor v o v cc v o_s ceramic capacitor R 1.0 f R 1.0 f 4.58.0v tsd 8 1 3 5 2 ocp soft start gnd en tsd 8 1 3 5 2 ocp soft start ceramic capacitor vo vcc fb r 1 r 2 ceramic capacitor R 1.0 f R 1.0 f 1.5v to 7.0v (vo+0.90) to 8.0v top view v o gnd n.c. n.c. n.c. en v cc fb/vo_s
4/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings (ta=25 ) parameter symbol limits unit power supply voltage v cc 10.0 * 1 v en voltage v en 10.0 v power dissipation htsop-j8 pd *2 2110 *2 mw operating temperature ra nge topr -40 to +105 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 not to exceed pd *2 reduced by 16.9mw/ for each increase in ta of 1 over 25 . (when mounted on a board 70mm 70mm 1.6mm glass-epoxy board, two layer) recommended operating ratings (ta=25 ) parameter symbol min. max. unit input power supply voltage v cc 4.5 8.0 v en voltage v en 0.0 8.0 v output voltage setting range v o 1.5 7.0 v output current i o 0.0 1.5 a electrical characteristics (unless otherwise noted, en=3v, vcc=6v, r 1 =43k , r 2 =8.2k ) parameter symbol temp min. typ. max. unit conditions 25 - 0 5 circuit current at shutdown mode i sd -40~105 - - 5 a v en =0v, off mode 25 - 600 900 bias current i cc -40~105 - - 1200 a 25 - 25 50 line regulation reg.i -40~105 - - 50 mv v cc =( vo+0.9v ) 8.0v 25 - 25 75 load regulation reg i o -40~105 - - 75 mv i o =0 1.5a 25 - 0.6 0.9 minimum dropout voltage v co -40~105 - - 1.2 v v cc =5v, i o =1.5a 25 0.792 0.800 0.808 output reference voltage (variable type) v fb -40~105 0.776 - 0.824 v i o =0ma 25 vo 0.99 vo vo1.01 output voltage(fixed type) v o -40~105 vo 0.97 vo vo1.03 v i o =0ma 25 0 - 0.8 en low voltage v en (low) -40~105 0 - 0.8 v 25 2.4 - 8.0 en high voltage v en (high) -40~105 2.4 - 8.0 v 25 1 3 9 en bias current i en -40~105 - - 9 a
5/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 typical performance curves (unless otherwise noted, en=3v, v cc =6v, r 1 =43k , r 2 =8.2k ) v en v en v o v o t. b . d t. b . d vo 50mv/div io 0.5a/div vo 50mv/div io 0.5a/div vo 50mv/div io 0.5a/div vo 50mv/div io 1a/div fig.6 transient response (1.0 0a) co=1f,ta=-40 fig.5 transient response (0 1.0a) co=1f,ta=105 10usec/div 10usec/div 10usec/div 2msec/div fig.6 transient response (1.0 0a) co=1f,ta=25 fig.5 transient response (0 1.0a) co=1f,ta=-40
6/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 fig.7 transient response (1.0 0a) co=1f,ta=25 vo 50mv/div io 1a/div vo 50mv/div io 1a/div fig.8 transient response (1.0 0a) co=1f,ta=105 vcc 2v/div vo 2v/div fig.9 input sequence 1 co=1f,ta=-40 vcc 2v/div vo 2v/div v en 2v/div fig.10 input sequence 1 co=1f,ta=25 v en 2v/div 2msec/div 2msec/div 200usec/div 200usec/div
7/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 vcc 2v/div vo 2v/div fig.11 input sequence 1 co=1f,ta=105 vcc 2v/div vo 2v/div fig.12 off sequence 1 co=1f,ta=-40 vcc 2v/div vo 2v/div fig.13 off sequence 1 co=1f,ta=25 vcc 2v/div fig.14 off sequence 1 co=1f,ta=105 v en 2v/div v en 2v/div v en 2v/div v en 2v/div vo 2v/div 1msec/div 40msec/div 40msec/div 40msec/div
8/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 v en 2v/div vcc 2v/div vo 2v/div fig.15 input sequence 2 co=1f,ta=-40 vcc 2v/div vo 2v/div fig.16 input sequence 2 co=1f,ta=25 v en 2v/div vcc 2v/div vo 2v/div fig.17 input sequence 2 co=1f,ta=105 v en 2v/div vcc 2v/div vo 2v/div fig.18 off sequence 2 co=1f,ta=-40 v en 2v/div 1msec/div 1msec/div 1msec/div 20msec/div
9/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 v en 2v/div vcc 2v/div vo 2v/div v en 2v/div vcc 2v/div vo 2v/div fig.19 off sequence 2 co=1f,ta=25 fig.20 off sequence 2 co=1f,ta=105 20msec/div 20msec/div v o [v] i cc [a] ta [ ] ta [ ] fig.21 ta - v o (i o =0ma) fig.22 ta - i cc
10/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 i en [a] i sd [a] i sd [a] v o [v] i o [a] v cc [v] ta [ ] ta [ ] fig.23 ta - i sd (v en =0v) fig.24 ta - i en fig.26 vcc-is d (ven=0v) fig.25 i o -v o
11/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 i o [a] v o [v] v o [v] v cc [v] v o [v] ta [ ] fig.27 vcc-vo (io=0ma) fig.28 tsd (i o =0ma) fig.29 i o -v o fig.30 minimum dropout voltage1 v cc =6v i o =1.0a vdrop[v]
12/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 i o [a] i cc [a] i o [a] p s rr [d b ] vdrop[v] fig.34 minimum dropout voltage 2 v cc =4.5v ta = 2 5 i o [a] fig.31 operation safety area fig.32 i o -i cc esr ( ?) fig.33 psrr(i o =0ma)
13/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 vdrop[v] vdrop[v] vdrop[v] vdrop[v] i o [a] i o [a] i o [a] i o [a] fig.35 minimum dropout voltage 2 v cc =6, ta=25 fig.36 minimum dropout voltage 2 v cc =8v, ta=25 fig.37 minimum dropout voltage 2 v cc =10, ta=25 fig.38 minimum dropout voltage 2 v cc =12v, ta=25
14/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 power dissipation htsop-j8 thermal design should allow operation within the following condi tions. note that the temperat ures listed are the allowed temperature limits, and thermal design should allow sufficient margin from the limits. 1. ambient temperature ta can be no higher than 105 . 2. chip junction temperature (tj) can be no higher than 150 . chip junction temperature can be determined as follows: most of the heat loss that occurs in the bdxxhc5mefj-m is generated from the output pch fet. power loss is determined by the total v cc -v o voltage and output current. be sure to confirm the system input and output voltage and the output current conditions in relation to the heat dissipation characteristics of the v cc and v o in the design. bearing in mind that heat dissipation may vary substantially depending on the subs trate employed (due to the power package incorporated in the bdxxhc5mefj-m make certain to factor conditions such as substrate size into the thermal design. power consumption[w] = input voltage (v cc ) - output voltage (v o ) i o (ave) example) where v cc =5.0v, v o =3.3v, i o (ave) = 0.1a, power consumption[w] = 5.0v - 3.3v 0.1a =0.17w calculation based on ambient temperature (ta) tj=ta+ j-a w reference values 1-layer substrate (copper foil density 0mm 0mm) 2-layer substrate (copper foil density 15mm 15mm) 2-layer substrate (copper foil density 70mm 70mm) 4-layer substrate (copper foil density 70mm 70mm) substrate size: 70mm 70mm 1.6mm (substrate with thermal via) j-a: htsop-j8 153.2 /w 113.6 /w 59.2 /w 33.3 /w measure condition: mounted on a rohm board, and ic substrate size: 70mm 70mm 1.6mm (substrate with thermal via) ? solder the substrate and package reverse exposure heat radiation part ic only j-a=249.5 /w 1-layer copper foil are :0mm 0mm j-a=153.2 /w 2-layer copper foil are :15mm 15mm j-a=113.6 /w 2-layer copper foil are :70mm 70mm j-a=59.2 /w 4-layer copper foil are :70mm 70mm j-a=33.3 /w power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 0.50w ?? :ta [ ] 1.0 0.50w 0.82w 1.10w 2.11w 3.76w ambient temperature :ta [ ]
15/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 input-to-output capacitor it is recommended that a capacitor is placed nearby pin between input pin and g nd, output pin and gnd. a capacitor, between input pin and gnd, is valid when the power supply impedance is high or drawing is long. also as for a capacitor, between output pin and gnd, the greater the capacity, more sustainable the line regulation and it makes improvement of characteristics by load c hange. however, please check by mounted on a board for the actual application. ceramic capacitor usually has difference, thermal characterist ics and series bias characteristics, and moreover capacity decreases gradually by using conditions. for more detail, please be sure to inquire the m anufacturer, and select the best ceramic capacitor. equivalent series resistance esr (ceramic capacitor etc.) please attach an anti-oscillation capacitor between v o and gnd. capacitor usually has esr(equivalent series resistance), and operates stable in esr-i o range, showed right. generally, esr of ceramic, tantalum and electronic capacitor etc. is different for each, so please be sure to check a capacitor which is going to use, and use it inside the stable operating region, showed right. then, please evaluate for the actual application. 0.01 0.10 1.00 10.00 0 0.3 0.6 0.9 1.2 1.5 io [a] esr [ ] safety area esr ? i o characteristics dc bias voltage [v] ceramic capacitor capacity ? dc bias characteristics (characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 0 1 2 3 4 rated voltage 10v b1 characteristics rated voltage 4v x6s characteristics capacitance change [%] rated voltage:10v f characteristics rated voltage 6.3v b characteristics b characteristics rated voltage 10v
16/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 evaluation board circuit evaluation board parts list board layout ? input capacitor c in of v cc (v in ) should be placed very close to v cc (v in ) pin as possible, and used broad wiring pattern. output capacitor c out also should be placed close to ic pin as possible. in case connected to inner layer gnd plane, please use several through hole. ? fb pin has comparatively high impedance, and is apt to be effe cted by noise, so floating capacity should be minimum as possible. please be careful in wiring drawing ? please take gnd pattern space widely, and design layout to be able to increase radiation efficiency. ? for output voltage setting output voltage can be set by fb pin voltage 0.800v typ. and external resistance r1, r2. the use of resistors with r1+r2=1k to 90k is recommended designation value part no. company designation value part no. company r1 43k mcr01pzpzf4302 rohm c4 \ \ \ r2 8.2k mcr01pzpzf8201 rohm c5 1f cm105x7r105k16ab kyocera r3 \ \ \ c6 r4 \ \ \ c7 \ \ \ r5 \ \ \ c8 \ \ \ r6 \ \ \ c9 \ \ \ c1 1f CM105B105K16A kyocera c10 \ \ \ c2 \ \ u1 \ bd00hc5mefj-m rohm c3 \ \ u2 \ \ \ v o = v fb r1+r2 r2 n.c gnd fb n.c n.c. v o 2 v o c7 3 4 7 5 u1 8 c1 c2 c3 r1 r2 c6 c5 1 v cc 6 en gnd sw1 en fin v cc v o en gnd ( v cc v in ) c in r 1 r2 c out
17/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 i/o equivalent circuits (output voltage vairable type) i/o equivalent circuits (output voltage fixed type) 8pin (v cc ) / 1pin (v o ) 2pin (fb) 5pin (en) 2pin (fb) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m 8pin (v cc ) / 1pin (v o ) 2pin (v o_s ) 5pin (en) 2pin (v o_s ) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m
18/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operational notes (1). absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus maki ng impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2). connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3). power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the powe r supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance char acteristic values are reduced at low temperatures. (4). gnd voltage the potential of gnd pin must be minimum potential in all operating conditions. (5). thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. (6). inter-pin shorts and mounting errors use caution when positioning the ic for mounting on print ed circuit boards. the ic may be damaged if there is any connection error or if pi ns are shorted together. (7). actions in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic fiel d as doing so may cause the ic to malfunction. (8). aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9). thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runaw ay. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. (10). testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic?s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precaution when transporti ng or storing the ic. tsd on temperature[ ] (typ.) hysteresis temperature [ ] (typ.) bdxxhc5mefj-m 175 15
19/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (11). regarding input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes o perate, such as applying a vo ltage that is lower than the gnd(p substrate) voltage to an input pin, should not be used. (12). ground wiring pattern. when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. resistor transistor (npn) n n n p + p + p p substrate gnd pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd p aras iti c element p aras iti c element parasitic element
20/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 physical dimension tape and reel information marking diagram (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin htsop-j8 (top view) xxhc5m part number marking lot number 1pin mark
21/21 bdxxhc5mefj-m datasheet tsz02201-0r6r0an00280-1-2 2012.8.31 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 revision history date revision changes 31.aug.2012 001 new release
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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